Automatic solder joint inspection utilizing color illumination.
نویسندگان
چکیده
منابع مشابه
Design of automatic vision-based inspection system for solder joint segmentation
Purpose: Computer vision has been widely used in the inspection of electronic components. This paper proposes a computer vision system for the automatic detection, localisation, and segmentation of solder joints on Printed Circuit Boards (PCBs) under different illumination conditions. Design/methodology/approach: An illumination normalization approach is applied to an image, which can effective...
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This paper describes the design and construction of an open automated solder bond veri cation machine for the electronics manufacturing industry The application domain is the higher end assembly technologies with an emphasis on ne pitch surface mount components The system serves a measurement function quantifying the solder bonds It interfaces with the manufacturing process to close the manufac...
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An optical solder joint inspection system(0SIIS) has been developed for the automatic visual inspection of soldered parts on the printed circuit boards. Its advantages over existing techniques include the detection of 3-0 shape of specular objects with high reliable and high speed. In this paper, we will propose a solder joint inspection scheme for a prototype of the OUIS. The inspection scheme...
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Surface Mount Technology (used in manufacture of the IBM PS/2) allows great flexibility in layout and very rapid assembly of densely populated circuit boards. The technique presents problems however in the positioning, soldering and testing of chips with very small gaps between leads (10 thousandths of an inch). Anticipated future improvements in the technology will make, conventional visual an...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 1990
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.56.1375